Light source module with high heat-dissipation efficiency

Details Light source module with high heat-dissipation efficiency Light source module with high heat-dissipation efficiency

2007-09-18

2009-08-11

Alavi, Ali (Department: 2875)

Illumination

Light source and modifier

With ventilating, cooling or heat insulating means

C362S373000, C361S707000, C257S722000

Reexamination Certificate

active

07572033

ABSTRACT:
An exemplary light source module includes a printed circuit board (PCB), a heat-dissipating assembly, and a number of light emitting elements. The PCB includes a first surface, an opposite second surface, and a number of through holes. The heat-dissipating assembly is located adjacent to the second surface and includes a base, a number of heat-conducting elements, and a number of heat dissipation fins. The base includes a third surface defining a number of cavities therein and an opposite fourth surface. The heat dissipation fins extend from the fourth surface. Each of the heat-conducting elements is inlaid in a corresponding cavity. Each of the light emitting elements is placed in a corresponding through hole and thermally contacts a corresponding heat-conducting element. Each light emitting element electrically connects with the PCB and defines a respective light emitting surface located outside the corresponding through hole.

REFERENCES:
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patent: 7098486 (2006-08-01), Chen
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patent: 7434964 (2008-10-01), Zheng et al.
patent: 2003/0156416 (2003-08-01), Stopa et al.
patent: 2006/0023448 (2006-02-01), Mok et al.
patent: 2743698 (2005-11-01), None

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