Light source apparatus and fabrication method thereof

Details Light source apparatus and fabrication method thereof Light source apparatus and fabrication method thereof

2011-01-11

2011-01-11

Gurley, Lynne A (Department: 2811)

Active solid-state devices (e.g., transistors, solid-state diode

Incoherent light emitter structure

Encapsulated

C257S098000, C257S099000, C257S635000, C257S687000, C257SE33058, C257SE33056, C257SE33057, C257SE33001

Reexamination Certificate

active

07868349

ABSTRACT:
A light source apparatus and a fabrication method thereof can prevent light interference between light emitting devices adjacent to each other and increase the luminous efficiency by collecting light emitted from the side of the light emitting device toward the front of a metal stem by forming grooves at a sub-mounts, bonding the light emitting device to the inside of the groove by a flip chip bonding method and forming a reflective layer inside the groove.

REFERENCES:
patent: 4797715 (1989-01-01), Thillays et al.
patent: 5003357 (1991-03-01), Kim et al.
patent: 6614172 (2003-09-01), Chiu et al.
patent: 6661031 (2003-12-01), Takaoka
patent: 7161187 (2007-01-01), Suehiro et al.
patent: 2002/0008325 (2002-01-01), Tominaga
patent: 2004/0184270 (2004-09-01), Halter
patent: 2005/0082561 (2005-04-01), Suehiro et al.
patent: 2005/0127485 (2005-06-01), Shei et al.
patent: 2006/0030063 (2006-02-01), Wang et al.
patent: 57-120386 (1982-07-01), None
patent: 59-27568 (1984-02-01), None
patent: 62-23163 (1987-01-01), None
patent: 2002-162626 (2002-06-01), None
patent: 10-2003-0054596 (2003-07-01), None

Affiliated with

Also associated with

Rating

Light source apparatus and fabrication method thereof does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Light source apparatus and fabrication method thereof, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Light source apparatus and fabrication method thereof will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2698027