Metal fusion bonding – With means to juxtapose and bond plural workpieces – Plural discrete workpieces
Patent
1992-08-20
1993-11-30
Heinrich, Samuel M.
Metal fusion bonding
With means to juxtapose and bond plural workpieces
Plural discrete workpieces
156566, 221211, 29743, 29759, H01L 2150
Patent
active
052657922
ABSTRACT:
A light emitting diode has both end faces metallized and is mounted on a substrate with the light emitting junction perpendicular to the substrate. The electrically conductive ends are electrically bonded to conductive areas on the substrate by solder or conductive adhesive LED dice can be placed on the substrate by temporarily attaching the dice to a tape which has been wrapped around a knife edge. The dice tilt as the tape wraps around the edge and are picked off one at a time by a vacuum collet while temporarily supported by a movable finger, and then transferred by the vacuum collet to a substrate. A similar method may be used for placing semiconductor dice on a substrate without the tilting of dice around the edge. In another embodiment, an array of LEDs can be assembled in windows through a metallized plastic tape which is bonded to a foundation with additional metallized leads.
REFERENCES:
patent: 4372802 (1983-02-01), Harigane et al.
patent: 4850780 (1989-07-01), Safabakhsh et al.
patent: 5084962 (1992-02-01), Takahashi et al.
Tatsuhiko Niina, "Advances in Liquid-Phase Epitaxy Solve Gap LED Production Problems", Journal of Electronic Engineering, Jul. 1975 No. 104, pp. 12-15.
Fajardo Thomas
Harrah Shane
Kreger Jerry D.
Smith Trevor J.
Uebbing John
Heinrich Samuel M.
Hewlett--Packard Company
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