Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Bump leads
Reexamination Certificate
2005-06-21
2005-06-21
Zarneke, David A. (Department: 2891)
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Bump leads
C257S781000
Reexamination Certificate
active
06909181
ABSTRACT:
There are provided a sealing insulating film that is formed on a substrate and melted at a first heating temperature to have a flowability, and external terminals that are formed on the substrate, and connected to other electronic device at a second heating temperature higher than the first heating temperature, and surrounded by the sealing insulating film.
REFERENCES:
patent: 5633204 (1997-05-01), Tago et al.
patent: 6255206 (2001-07-01), Jang et al.
patent: 6413851 (2002-07-01), Chow et al.
patent: 6420255 (2002-07-01), Takahashi
patent: 6461894 (2002-10-01), Brand
patent: 6590287 (2003-07-01), Ohuchi
patent: 2002/0132463 (2002-09-01), Urushima
patent: 2003/0001283 (2003-01-01), Kumamoto
patent: 2003/0096495 (2003-05-01), Ihara et al.
DM4030LD Product Data Sheet from diemat.com.
Aiba Yoshitaka
Matsuki Hirohisa
Sato Mitsutaka
Fujitsu Limited
Zarneke David A.
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