Light illumination during wafer dicing to prevent aluminum...

Details Light illumination during wafer dicing to prevent aluminum... Light illumination during wafer dicing to prevent aluminum...

2011-08-16

2011-08-16

Lee, Hsien-ming (Department: 2823)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Making plural separate devices

C438S460000, C257SE23158

Reexamination Certificate

active

07998793

ABSTRACT:
Illumination devices (7a) and (7b) which irradiate light having a wavelength of 1.1 μm or less are arranged on a front surface and a rear surface of a cover (8) of a dicing device (1). After a wafer is placed on a dicing stage (3), when the wafer is diced by a blade (4a) attached to a spindle (5), light is irradiated on an entire surface of an upper surface (element forming surface) of the wafer by the illumination devices (7a) and (7b). At this time, an illuminance of light on the wafer is set at 70 lux or more and 2000 lux or less. By this means, during a dicing operation, an area to be a light-shielded area by the spindle (5) or the like is not present on the wafer.

REFERENCES:
patent: 4213117 (1980-07-01), Kembo et al.
patent: 5668033 (1997-09-01), Ohara et al.
patent: 5716459 (1998-02-01), Chang et al.
patent: 5842461 (1998-12-01), Azuma
patent: 5904547 (1999-05-01), Flynn
patent: 5972154 (1999-10-01), Konya
patent: 6153043 (2000-11-01), Edelstein et al.
patent: 6283440 (2001-09-01), Evans
patent: 6582983 (2003-06-01), Runyon et al.
patent: 6989608 (2006-01-01), Rochette
patent: 7288466 (2007-10-01), Takeishi et al.
patent: 2002/0173229 (2002-11-01), Kobayashi
patent: 2003/0034120 (2003-02-01), Yanagisawa et al.
patent: 2003/0118476 (2003-06-01), Fujii et al.
patent: 2004/0065851 (2004-04-01), Inoue
patent: 2004/0089282 (2004-05-01), Akram et al.
patent: 0 831 357 (1998-03-01), None
patent: 54-130880 (1979-10-01), None
patent: 5-259275 (1993-10-01), None
patent: 6-232255 (1994-08-01), None
patent: 6-252144 (1994-09-01), None
patent: 9-17752 (1997-01-01), None
patent: 10-90671 (1998-04-01), None
patent: 11-274114 (1999-10-01), None
patent: 11-297644 (1999-10-01), None
patent: 2001-211044 (2001-08-01), None
patent: 2004-095856 (2004-03-01), None
patent: 2005-313253 (2005-11-01), None
Office Action from counterpart Chinese Appln. No. 2004-800438858.

Affiliated with

Also associated with

Rating

Light illumination during wafer dicing to prevent aluminum... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Light illumination during wafer dicing to prevent aluminum..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Light illumination during wafer dicing to prevent aluminum... will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2744168