Light gate assemblies, elements and manufacturing methods

Details Light gate assemblies, elements and manufacturing methods Light gate assemblies, elements and manufacturing methods

1979-04-30

1984-10-23

Punter, William H.

Electricity: electrical systems and devices

Safety and protection of systems and devices

With specific current responsive fault sensor

361383, 361399, 361415, G02F 103, H05K 700

Patent

active

044784953

ABSTRACT:
Elongate light gate structures are composed of a plurality of individual chips of electrooptically active light gate material displaying field induced birefringence. The individual chips are provided in rectangular configuration. Each chip has a plurality of alternating electrodes and elongate light gate regions distributed there along. A rigid mounting beam has a pair of spaced parallel elongate mounting surfaces for the light gate chips and an elongate opening located between and extending along these mounting surfaces for the flow of light to or from the mounted chips. The chips may be retained on the rigid beam by chip mounting clips. The chips may be located between polarizer and analyzer filters. Driver circuit boards may be interfaced with and appropriately leveled relative to the mounted chips.

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Zak, Advertisement Zak Breadboards, 3-1955, pp. 3-7.
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Ing, P. W., "Parallel Air Cooling for Planar Package Devices", IBM Tech. Discl. Bull., 6-1971, p. 181.
Cutchen et al., "PLZT Electro Optic Shutters: Applications", App. Optics, 8-1975, pp. 1866-1873.
Cutchen et al., "Electro Optic Devices Utilizing Quadratic PLZT Ceramic Elements, 1973 Wescon Tech. Papers, Sec. 30/2.

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