Light emitting module and process thereof

Details Light emitting module and process thereof Light emitting module and process thereof

2006-08-14

2009-02-24

Lee, Jong-Suk (James) (Department: 2885)

Illumination

Light source and modifier

With ventilating, cooling or heat insulating means

C362S800000, C362S555000, C362S373000, C257S099000

Reexamination Certificate

active

07494250

ABSTRACT:
A light emitting module includes a metal substrate, a bearing base, at least one LED, a printed circuit board, and at least one conductive wire. A first perforation is formed on the metal substrate and the bearing base is embedded into the first perforation of the metal substrate. According to an eutectic soldering method, the LED(s) is/are adhered on the bearing base by a compound metal. A second perforation is formed on the printed circuit board to expose the LED(s) which is/are adhered on the bearing base and further allows the printed circuit board to stick on the metal substrate. The conductive wires are used to connect electrically the LED(s) with the printed circuit board.

REFERENCES:
patent: 5534718 (1996-07-01), Chang
patent: 6034712 (2000-03-01), Iwasaki
patent: 6517218 (2003-02-01), Hochstein
patent: 7030423 (2006-04-01), Chang et al.
patent: 7138667 (2006-11-01), Barnett et al.
patent: 2005/0133808 (2005-06-01), Uraya et al.
patent: 2005/0231983 (2005-10-01), Dahm

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