Light emitting module and method for manufacturing the same

Details Light emitting module and method for manufacturing the same Light emitting module and method for manufacturing the same

2011-08-16

2011-08-16

Semenenko, Yuriy (Department: 2835)

Electricity: conductors and insulators

Conduits, cables or conductors

Preformed panel circuit arrangement

C257S678000, C363S150000

Reexamination Certificate

active

07999190

ABSTRACT:
Provided are: a light emitting module which has an improved heat-dissipating property and whose reflectance reduction is prevented. The light emitting module mainly includes: a metal substrate; a conductive pattern formed on the upper surface of the metal substrate; and a light emitting element disposed on the upper surface of the metal substrate and electrically connected to the conductive pattern. Furthermore, in the light emitting module, an insulating layer is removed in a region where the conductive pattern is not formed, but is left unremoved in a region right below (or covered with) the conductive pattern. In other words, in the region where the conductive pattern is not formed, the upper surface of the metal substrate is not covered with the conductive pattern, and a metal material constituting the metal substrate is exposed.

REFERENCES:
patent: 2007/0170563 (2007-07-01), Chen
patent: 2007/0195528 (2007-08-01), Wu
patent: 2007/0290307 (2007-12-01), Lin
patent: 2008/0084699 (2008-04-01), Park et al.
patent: 2006-100753 (2006-04-01), None
patent: 2006100753 (2006-04-01), None

Affiliated with

Also associated with

Rating

Light emitting module and method for manufacturing the same does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Light emitting module and method for manufacturing the same, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Light emitting module and method for manufacturing the same will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2738513