Light emitting diode with ITO layer and method for...

Semiconductor device manufacturing: process – Making device or circuit emissive of nonelectrical signal

Reexamination Certificate

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C438S039000, C438S066000, C438S080000, C438S082000, C438S089000, C315S122000, C315S125000, C315S145000, C315S147000, C315S310000, C257S072000, C257S079000, C257S088000, C257S091000, C257S093000, C257S094000, C257S095000, C257SE31099, C257SE31105, C257SE31126, C257SE33001

Reexamination Certificate

active

07998761

ABSTRACT:
The present invention relates to a light emitting diode with enhanced luminance and light emitting performance due to increase in efficiency of current diffusion into an ITO layer, and a method of fabricating the light emitting diode. According to the present invention, there is manufactured at least one light emitting cell including an N-type semiconductor layer, an active layer and a P-type semiconductor layer on a substrate. The method of the present invention comprises the steps of (a) forming at least one light emitting cell with an ITO layer formed on a top surface of the P-type semiconductor layer; (b) forming a contact groove for wiring connection in the ITO layer through dry etching; and (c) filling the contact groove with a contact connection portion made of a conductive material for the wiring connection.

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German Office Action dated Dec. 15, 2008.

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