Light-emitting diode with cavity containing a filler

Active solid-state devices (e.g. – transistors – solid-state diode – Incoherent light emitter structure – With housing or contact structure

Reexamination Certificate

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Details

C257S081000, C257S091000, C257S098000

Reexamination Certificate

active

06903381

ABSTRACT:
The present invention discloses a light-emitting diode and a method for manufacturing such a light-emitting diode with a direct band-gap III-V compound semiconductor material on a GaAs substrate. It is implemented by forming a first conductive electrode on the top edge of the epitaxial LED layer and a second conductive electrode opposite the first conductive electrode on the edge of a transparent substrate. Further, after the first conductive electrode and second conductive electrode are connected by chip bonding skill, it is selectively to remove the GaAs substrate and plate a transparent electrode on the top portion of the epitaxial LED layer. Therefore, when casting from P-N junction of the light-emitting diode, the light will go through with directions of the top portion of epitaxial layer and transparent substrate.

REFERENCES:
patent: 4864369 (1989-09-01), Snyder et al.
patent: 5502316 (1996-03-01), Kish et al.
patent: 6221683 (2001-04-01), Nirschl et al.
patent: 6245588 (2001-06-01), Abe
patent: 6492661 (2002-12-01), Chien et al.
patent: 6512248 (2003-01-01), Takeuchi et al.
patent: 6844571 (2005-01-01), Krames et al.
patent: 2003/0085851 (2003-05-01), Horng et al.

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