Light emitting diode with bumps

Details Light emitting diode with bumps Light emitting diode with bumps

2006-05-02

2011-10-25

Roy, Sikha (Department: 2879)

Electric lamp and discharge devices

With luminescent solid or liquid material

Solid-state type

C313S501000, C313S498000, C313S110000, C257S098000, C257S099000, C257S100000

Reexamination Certificate

active

08044585

ABSTRACT:
A light-emitting diode includes a package, a light-emitting diode chip and a lens. The light-emitting diode chip is mounted on the package. The lens is mounted on the package and envelops the light-emitting diode chip, wherein the lens has a plane region surrounding the package and a bumpy region with a plurality of bumps fully arranged thereon adjacent to the plane region.

REFERENCES:
patent: 4843280 (1989-06-01), Lumbard et al.
patent: 5485317 (1996-01-01), Perissinotto et al.
patent: 6755556 (2004-06-01), Gasquet et al.
patent: 7422347 (2008-09-01), Miyairi et al.
patent: 7473013 (2009-01-01), Shimada
patent: 2003/0089914 (2003-05-01), Chen
patent: 2003/0151361 (2003-08-01), Ishizaka
patent: 2005/0001228 (2005-01-01), Braune et al.

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