Light emitting diode system, method for producing such a...

Active solid-state devices (e.g. – transistors – solid-state diode – Incoherent light emitter structure – With housing or contact structure

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C257S079000, C257S098000, C257S100000, C257S433000, C257S434000, C257S706000, C257S707000, C438S122000, C438S125000

Reexamination Certificate

active

07872278

ABSTRACT:
A light-emitting diode system (1) comprising at least one light-emitting diode component (2), in which a light-emitting diode chip is arranged in a light-emitting diode housing (21) on a heat sink (22) which can be thermally connected at the rear side (25) of the light-emitting diode housing (21). A carrier plate (3) having a front side (34) and a rear side (31) and a hole for receiving the light-emitting diode component (2) is provided. The light-emitting diode component (2) projects into the hole from the rear side (31) of the carrier plate (3). An electrically insulating thermal connection layer (5) is applied at the rear side (31) of the carrier plate (3), said thermal connection layer being thermally conductively connected to the heat sink (22). A method for producing a light-emitting diode system is also described.

REFERENCES:
patent: 6274924 (2001-08-01), Carey et al.
patent: 6949772 (2005-09-01), Shimizu et al.
patent: 6999318 (2006-02-01), Newby
patent: 7592631 (2009-09-01), Park et al.
patent: 2005/0024834 (2005-02-01), Newby
patent: 2006/0043382 (2006-03-01), Matsui et al.
patent: 2006/0098441 (2006-05-01), Chou
patent: 2006/0202210 (2006-09-01), Mok et al.
patent: 2006/0232969 (2006-10-01), Bogner et al.
patent: 2007/0030703 (2007-02-01), Lee et al.
patent: 2008/0023721 (2008-01-01), Lee et al.
patent: 102 29 067 (2004-01-01), None
patent: 102 45 892 (2004-05-01), None
patent: 20 2005 012 652 (2005-12-01), None
patent: 10 2005 011 857 (2006-09-01), None
patent: WO 02/084749 (2002-10-01), None
patent: WO 2006/097225 (2006-09-01), None
OSRAM Opto Semiconductors GmbH, “Thermal Management of Golden DRAGON LED”, http://catalog.osram-os.com/media/—en/Graphics/00036578—0.pdf.
The Bergquist Company, Sil-Pad®, http://www.bergquistcompany.com/objects/Thermal—Materials/Sil—Pad/Sil—Pad—Tables/SPComparison2.pdf, e.g. Sil-Pad® 800-Folie.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Light emitting diode system, method for producing such a... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Light emitting diode system, method for producing such a..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Light emitting diode system, method for producing such a... will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-2628899

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.