Active solid-state devices (e.g. – transistors – solid-state diode – Incoherent light emitter structure – With housing or contact structure
Reexamination Certificate
2008-06-24
2011-10-25
Richards, N Drew (Department: 2895)
Active solid-state devices (e.g., transistors, solid-state diode
Incoherent light emitter structure
With housing or contact structure
C257S081000, C257S618000, C257S707000, C257SE33063, C438S026000, C362S235000, C362S294000, C362S373000, C362S547000, C362S800000, C313S046000, C029S726000, C029S832000, C029S840000, C029S842000, C029S843000, C029S846000
Reexamination Certificate
active
08044427
ABSTRACT:
This invention relates to the thermal management, extraction of light, and cost effectiveness of Light Emitting Diode, or LED, electrical circuits. An integrated circuit LED submount is described, for the packaging of high power LEDs. The LED submount provides high thermal conductivity while preserving electrical insulation. In particular, a process is described for anodizing a high thermal conductivity aluminum alloy sheet to form a porous aluminum oxide layer and a non-porous aluminum oxide layer. This anodized aluminum alloy sheet acts as a superior electrical insulator, and also provides surface morphology and mechanical properties that are useful for the fabrication of high-density and high-power multilevel electrical circuits.
REFERENCES:
patent: 3864219 (1975-02-01), Dosch et al.
patent: 3964982 (1976-06-01), Kim
patent: 4936957 (1990-06-01), Dickey et al.
patent: 5468694 (1995-11-01), Taguchi et al.
patent: 5482614 (1996-01-01), Kondo et al.
patent: 5925228 (1999-07-01), Panitz et al.
patent: 6455930 (2002-09-01), Palanisamy et al.
patent: 6466881 (2002-10-01), Shih et al.
patent: 6774050 (2004-08-01), Ahn et al.
patent: 6885035 (2005-04-01), Bhat et al.
patent: 2007/0062032 (2007-03-01), Ter-Hovhannissian
patent: 2007/0215895 (2007-09-01), Amoh et al.
patent: 2007/0257335 (2007-11-01), O'Brien
patent: 2008/0006837 (2008-01-01), Park et al.
patent: 2008/0032473 (2008-02-01), Bocek et al.
patent: 2010/0067224 (2010-03-01), Wu
patent: WO 2008058446 (2008-05-01), None
AW Austral Wright Metals, Aluminum 1100 Product Data Sheet, Austral Bronze Crane Copper Limited, ACN 008 466 840, 2 pages, Published Jan. 2005.
Thermal Solutions, “Insulated Aluminum Substrates Thermal Solutions for Hi Brightness LED Applications” TT Electronics, Issue May 2006, 6 pages.
A. P. Li, F. Muller, A. Birner, K. Nielsch, and U. Gosele, “Hexagonal Pore Arrays with a 50-420 nm Interpore Distance Formed by Self-Organization in Anodic Alumina” 1998 American Institute of Physics, J. Appl. Phys., vol. 84, No. 11, Dec. 1998, pp. 6023-6026.
G.D. Sulka, S. Stroobants, V. Moshchalkov, G. Borghs, and J.P.Celis, “Synthesis of Well-Ordered Nanopores by Anodizing Aluminum Foils in Sulfuric Acid”, Journal of the Electrochemical Society, 149 (7), 2002, pp. D97-D103.
Lee Ho-Shang
Lu Junying
Su Wen-Herng
Davis , Wright, Tremaine, LLP
DiCon Fiberoptics, Inc.
Dulka John P
Richards N Drew
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