Light emitting diode printhead

Electric lamp and discharge devices – With luminescent solid or liquid material – Solid-state type

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313 36, 346107R, 437205, 257 79, H01J 188

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active

053230841

ABSTRACT:
A printhead for a light emitting diode printer has a transparent substrate with a row of LED dice mounted on the substrate with their light emitting Junctions adjacent to the substrate so as to emit light through the substrate. Each die has a row of LEDs along its length and a row of connection pads at known locations for making electrical connection to the LED anodes. Metal lines are deposited on the transparent substrate at known locations. Solder bumps between the connection pads and metal lines precisely position the dice by reason of surface tension. The dice are positioned in parallel rows with alternate dice staggered from each other for electrical isolation and to avoid mechanical interference at the ends of adjacent dice. In the event placement by way of the solder bumps is insufficiently precise, an opaque layer may be deposited on the substrate with a row of windows adjacent a row of LEDs. The windows are smaller than the LEDs so as to mask edge portions and alleviate alignment requirements.

REFERENCES:
patent: 4435064 (1984-03-01), Tsukada et al.
patent: 4749120 (1988-06-01), Hatada
patent: 4875057 (1989-10-01), Hediger
patent: 4942405 (1990-07-01), Dody
patent: 4947195 (1990-08-01), Flynn et al.
patent: 4951098 (1990-08-01), Albergo
Hatada, et al., A New LSI Bonding Technology "Micron Bump Bonding Assembly Technology", 1988, pp. 23-27.
Hatada, et al., A New LSI Bonding Technology "Micron Bump Bonding Technology" 1989, pp. 45-49.
Hatada, et al., Applications of New Assembly Method "Micron Bump Bonding Method", 1989, pp. 45-48, IEEE/CHMT '89 Japan IEMT Symposium.
Hatada, et al., LED Array Modules by New Method Micron Bump Bonding Method 1989 IEEE, pp. 230-233, IEEE/CHMT '89 IEMT Symposium.
Seventh IEEE/CHMT International Electronic Manufacturing Technology Symposium-"Integration of the Manufacturing Flow-From Raw Material Through Systems-Level Assembly", Sep. 25-27, 1989, San Francisco, Calif., pp. 245-248.
Hatada, et al-New-Film-Carrier-Assembly Technology-"Transferred Bump Tab" 1988 IEEE, pp. 122 to 127.
Hatada, et al, Application to the Electronic Instrument by Transferred Bump-Tab Technology, 1987 IEEE, pp. 81 to 86.

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