Light-emitting diode packaging structure and light-emitting...

Details Light-emitting diode packaging structure and light-emitting... Light-emitting diode packaging structure and light-emitting...

2011-07-19

2011-07-19

Pert, Evan (Department: 2893)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Device held in place by clamping

C257S688000, C257S726000, C257S785000, C257SE33062, C174S555000, C439S358000

Reexamination Certificate

active

07982308

ABSTRACT:
A light-emitting diode packaging structure, a packaging module and the assembling method thereof are disclosed. The assembling method comprises the steps of: providing a light-emitting diode, wherein the light-emitting diode has two electrode leads; providing two metal plates, wherein each of the metal plates has at least a clamping portion; holding the electrode leads against the metal plates respectively; and bending the clamping portion of each of the metal plates to fix the electrode leads on the metal plates. Further, a plurality of light-emitting diodes are allowed to be mounted on the metal plates to form the light-emitting diode packaging module.

REFERENCES:
patent: 6335548 (2002-01-01), Roberts et al.
patent: 7070418 (2006-07-01), Wang
patent: 2008/0224166 (2008-09-01), Glovatsky et al.

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