Active solid-state devices (e.g. – transistors – solid-state diode – Incoherent light emitter structure – With housing or contact structure
Reexamination Certificate
2008-08-21
2010-06-15
Cao, Phat X (Department: 2814)
Active solid-state devices (e.g., transistors, solid-state diode
Incoherent light emitter structure
With housing or contact structure
C257S100000, C257S065000, C257S712000, C257S699000, C257SE33075
Reexamination Certificate
active
07737463
ABSTRACT:
Disclosed is a light emitting diode (LED) package having multiple molding resins. The LED package includes a pair of lead terminals and a heat sink inserted into a heat sink support ring. At least portions of the pair of lead terminals and the heat sink are embedded in a package main body. The package main body has an opening through which the pair of lead terminals is exposed. An LED die is mounted in the opening and electrically connected to the pair of lead terminals. A first molding resin covers the LED die. A second molding resin with higher hardness than the first molding covers the first molding resin. Therefore, stress to be imposed on the LED die can be reduced and the deformation of the molding resins can be prevented.
REFERENCES:
patent: 5177669 (1993-01-01), Juskey
patent: 5958100 (1999-09-01), Farnworth
patent: 6274924 (2001-08-01), Carey et al.
patent: 6517218 (2003-02-01), Hochstein
patent: 6747293 (2004-06-01), Nitta et al.
patent: 6924514 (2005-08-01), Suenaga
patent: 7321161 (2008-01-01), Teixeira et al.
patent: 2001/0030866 (2001-10-01), Hochstein
patent: 2004/0041222 (2004-03-01), Loh
patent: 2004/0227149 (2004-11-01), Ibbetson et al.
patent: 2006/0012299 (2006-01-01), Suehiro
patent: 2006/0103012 (2006-05-01), Chin
patent: 10214119 (2003-10-01), None
patent: 1246266 (2002-10-01), None
patent: 1249874 (2002-10-01), None
patent: 1439584 (2004-07-01), None
patent: 1484802 (2004-12-01), None
patent: 7111343 (1995-04-01), None
patent: 8-335720 (1996-12-01), None
patent: 11-121809 (1999-04-01), None
patent: 11112036 (1999-04-01), None
patent: 2001223305 (2001-08-01), None
patent: 2002314139 (2002-10-01), None
patent: 2002359403 (2002-12-01), None
patent: 2004-221598 (2004-08-01), None
patent: 2004235261 (2004-08-01), None
patent: 2134000 (1999-07-01), None
patent: 0055914 (2000-09-01), None
patent: WO 2004102685 (2004-11-01), None
patent: 2006006544 (2006-01-01), None
Non-Final Office Action dated Jul. 24, 2009 issued in U.S. Appl. No. 11/575,128.
European Search Report dated Aug. 24, 2009.
Kim Do Hyung
Lee Chung Hoon
Lee Keon Young
Cao Phat X
Garrity Diana C
H.C. Park & Associates PLC
Seoul Semiconductor Co. Ltd.
LandOfFree
Light emitting diode package with a heat sink support ring... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Light emitting diode package with a heat sink support ring..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Light emitting diode package with a heat sink support ring... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-4197670