Active solid-state devices (e.g. – transistors – solid-state diode – Incoherent light emitter structure – With housing or contact structure
Reexamination Certificate
2011-04-12
2011-04-12
Pert, Evan (Department: 2826)
Active solid-state devices (e.g., transistors, solid-state diode
Incoherent light emitter structure
With housing or contact structure
C257SE33058
Reexamination Certificate
active
07923746
ABSTRACT:
The present invention discloses a light emitting diode (LED) package structure, which includes a carrier, a first protrusion, a LED chip, and an adhesion layer. The first protrusion is disposed on the carrier and has a first opening to expose the carrier, wherein the first protrusion is formed by a thermal conductive material. The LED chip is disposed in the first opening on the carrier, and a ratio between a width of the first opening and a width of the LED chip is 1˜1.5. The adhesion layer is disposed between the LED chip and the carrier to bond the LED chip to the carrier.
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“1st Office Action of China Counterpart Application” issued on May 21, 2010, p.1-p.6.
Hsu Chen-Peng
Hu Hung-Lieh
Li Chao-Wei
Tsai Yao-Jun
Industrial Technology Research Institute
Jianq Chyun IP Office
Pert Evan
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