Semiconductor device manufacturing: process – Making device or circuit emissive of nonelectrical signal – Packaging or treatment of packaged semiconductor
Reexamination Certificate
2011-08-30
2011-08-30
Landau, Matthew C. (Department: 2813)
Semiconductor device manufacturing: process
Making device or circuit emissive of nonelectrical signal
Packaging or treatment of packaged semiconductor
C438S029000, C438S112000, C438S118000, C438S126000, C438S127000, C257SE33056, C257SE33059, C257SE33066, C257SE21502
Reexamination Certificate
active
08008100
ABSTRACT:
A light emitting diode (LED) package and a manufacturing method therefore are disclosed. The LED package comprises: a transparent substrate, a transparent LED chip, a transparent adhesive for bonding the transparent LED chip, a lead frame, conductive wires, and an encapsulant. In the manufacturing method, a heating step is first performed to heat a first transparent plastic material to be a sticky member. Thereafter a connecting step is performed to connect the lead frame to the sticky member. Then a chip-bonding step is performed to bond the LED chips on the sticky member. Thereafter a wire-bonding step is performed to electrically connect the transparent LED chip to the lead frame. Then an encapsulating step is performed to encapsulate the transparent LED chips with a second transparent plastic material. Thereafter a drying step is performed to form the shapes of the sticky member and the second transparent plastic material.
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Chang Cheng-Yi
Lin Ming-Kuei
Tsai Chih-Chia
David Pai Chao-Chang
Everylight Electronics Co., Ltd.
Landau Matthew C.
Nicely Joseph C
Pai Patent & Trademark Law Firm
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