Active solid-state devices (e.g. – transistors – solid-state diode – Incoherent light emitter structure – With reflector – opaque mask – or optical element integral...
Reexamination Certificate
2009-01-15
2011-10-25
Louie, Wai Sing (Department: 2814)
Active solid-state devices (e.g., transistors, solid-state diode
Incoherent light emitter structure
With reflector, opaque mask, or optical element integral...
C257S100000, C257S099000, C257SE33059, C257SE33061, C257SE33066, C257S676000, C257SE23037, C257SE21532
Reexamination Certificate
active
08044420
ABSTRACT:
The present invention relates to a method for forming a package structure for a light emitting diode (LED) and the LED package structure thereof. By employing the same sawing process to cut through the trenches of the leadframe, the package units are singulated and different lead portions are simultaneously separated from each other in each package unit. Therefore, the overflow issues of the encapsulant can be avoided without using extra taping process.
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patent: 2010/0270571 (2010-10-01), Seo
Jeong Hyunsoo
Lee Hyunil
Lee Seongoo
Park Ryungshik
Advanced Semiconductor Engineering Inc.
J.C. Patents
Jahan Bilkis
Louie Wai Sing
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