Light emitting diode package including thermoelectric element

Details Light emitting diode package including thermoelectric element Light emitting diode package including thermoelectric element

2011-04-19

2011-04-19

Smoot, Stephen W (Department: 2813)

Active solid-state devices (e.g., transistors, solid-state diode

Incoherent light emitter structure

With reflector, opaque mask, or optical element integral...

C257S099000, C257SE23082, C257SE33075

Reexamination Certificate

active

07928459

ABSTRACT:
The present invention relates to a light emitting diode package, and provides a light emitting diode package employing a thermoelectric element therein. The light emitting diode package of the present invention is constructed such that the thermoelectric element is coupled to a housing or formed of a substrate itself so as to directly dissipate heat generated from a light emitting chip. Thus, the heat generated from the light emitting chip can be efficiently dissipated from the interior of the package to the outside, without an additional heat dissipation means. In addition, an external heat sink may be coupled to the thermoelectric element to more efficiently dissipate the heat from the light emitting chip.

REFERENCES:
patent: 6506624 (2003-01-01), Tatoh et al.
patent: 6514791 (2003-02-01), Dautartas et al.
patent: 6727423 (2004-04-01), Tauchi et al.
patent: 6855566 (2005-02-01), Tatoh et al.
patent: 2004/0155251 (2004-08-01), Abramov et al.
patent: 2005/0008049 (2005-01-01), Oomori et al.
patent: 2004-303750 (2004-10-01), None

Affiliated with

Also associated with

Rating

Light emitting diode package including thermoelectric element does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Light emitting diode package including thermoelectric element, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Light emitting diode package including thermoelectric element will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2730729