Light emitting diode package employing lead terminal with...

Active solid-state devices (e.g. – transistors – solid-state diode – Incoherent light emitter structure – With housing or contact structure

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C257S098000, C257SE33027, C313S512000, C438S029000

Reexamination Certificate

active

07999280

ABSTRACT:
Disclosed is a light emitting diode (LED) package employing a lead terminal with a reflecting surface. The package includes first and second lead terminals that are spaced apart from each other. The first lead terminal has a lower portion with an LED chip mounting area, and at least one reflecting surface formed by being bent from the lower portion. Meanwhile, a package body supports the first and second lead terminals and forms a cavity through which the LED chip mounting area and the reflecting surface of the first lead terminal and a part of the second lead terminal are exposed. The first and second lead terminals extend outside of the package body. Accordingly, light emitted from an LED chip can be reflected on the reflecting surface with high reflectivity, so that the optical efficiency of the package can be improved.

REFERENCES:
patent: 3914786 (1975-10-01), Grossi
patent: 6995510 (2006-02-01), Murakami et al.
patent: 2003/0107316 (2003-06-01), Murakami
patent: 2004/0248332 (2004-12-01), Yoon
patent: 2005/0133939 (2005-06-01), Chikugawa
patent: 2006/0108669 (2006-05-01), Matsumoto et al.
patent: 1081761 (2001-03-01), None
patent: 1548905 (2005-06-01), None
patent: 60180176 (1985-09-01), None
patent: 2004-146815 (2004-05-01), None
patent: 2004-363533 (2004-12-01), None
patent: 2005-183531 (2005-07-01), None
patent: 2005-294736 (2005-10-01), None
patent: 2006-024645 (2006-01-01), None
patent: 2007-194579 (2007-08-01), None
European Search Report dated Nov. 30, 2007.
European Search Report dated Mar. 16, 2009.
European Examination Report dated Jul. 29, 2010 for European Patent Application No. 07.011 775.9, corresponding to U.S. Appl. No. 11/780,051.
Preliminary Notice of the First Office Action of Taiwanese Patent Application No. 096116453 issued on Jan. 27, 2011, corresponding to U.S. Appl. No. 11/780,051.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Light emitting diode package employing lead terminal with... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Light emitting diode package employing lead terminal with..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Light emitting diode package employing lead terminal with... will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-2662162

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.