Light emitting diode package assembly

Active solid-state devices (e.g. – transistors – solid-state diode – Incoherent light emitter structure – Plural light emitting devices

Reexamination Certificate

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Details

C257S091000, C257S100000, C257SE33056, C313S500000, C438S028000

Reexamination Certificate

active

08067777

ABSTRACT:
An electrical device containing multiple light emitting diode (LED) dies each having respective first and second connectors suitable to receive current through the LED die. A common base layer of a first electrically conductive material has cavities into which at least one LED die is mounted with its second connector electrically connected by a conductive bonding material to the first conductive material of the base layer. One or more over-layer sections of a second electrically conductive material each are electrically connected by a bond to at least one of the first connector of an LED die. And an insulator electrically separates the first conductive material of the base layer from the second conductive material of over-layer sections.

REFERENCES:
patent: 6531328 (2003-03-01), Chen
patent: 6930332 (2005-08-01), Hashimoto et al.
patent: 7038195 (2006-05-01), Kida et al.
patent: 7308195 (2007-12-01), Yumiki et al.
patent: 7352127 (2008-04-01), Jeganathan et al.
patent: 2005/0280019 (2005-12-01), Konno
patent: 2007/0263408 (2007-11-01), Chua
patent: 2008/0265272 (2008-10-01), Oh et al.
patent: 2009/0146158 (2009-06-01), Park
patent: 2006-344690 (2006-12-01), None
patent: 2004/068596 (2004-08-01), None
patent: WO 2004/068596 (2004-08-01), None
PCT/US2008/072990, International Search Report and Written Opinion dated Mar. 11, 2009.

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