Light emitting diode package and method of manufacturing the...

Details Light emitting diode package and method of manufacturing the... Light emitting diode package and method of manufacturing the...

2011-06-07

2011-06-07

Tran, Minh-Loan T (Department: 2826)

Active solid-state devices (e.g., transistors, solid-state diode

Incoherent light emitter structure

With housing or contact structure

C257S081000, C257S088000, C257S100000, C257S676000, C257S690000, C257S696000, C257S786000, C257SE23031, C257SE23070, C257SE23011, C361S760000, C361S764000

Reexamination Certificate

active

07956378

ABSTRACT:
Provided is a light emitting diode package and a method of manufacturing the same. The light emitting diode package includes a package main body with a cavity, a plurality of light emitting diode chips, a wire, and a plurality of lead frames. The plurality of light emitting diode chips are mounted in the cavity. The wire is connected to an electrode of at least one light emitting diode chip. The plurality of lead frames are formed in the cavity, and at least one lead frame is electrically connected to the light emitting diode chip or a plurality of wires.

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