Light emitting diode package and manufacturing method thereof

Details Light emitting diode package and manufacturing method thereof Light emitting diode package and manufacturing method thereof

2008-09-30

2011-10-25

Smith, Zandra (Department: 2822)

Semiconductor device manufacturing: process

Making device or circuit emissive of nonelectrical signal

Packaging or treatment of packaged semiconductor

C438S026000, C438S110000, C438S126000

Reexamination Certificate

active

08043876

ABSTRACT:
Disclosed are a light emitting diode package and a manufacturing method thereof. According to an embodiment of the present invention, the method includes: manufacturing a package main body having a plurality of cavities, the cavities being formed in a line on one surface, through molding by putting thermoplastic polymer into a previously produced mold; forming an electrode passing through the package main body; mounting a light emitting diode chip on a basal surface of the each cavity formed in the package main body; connecting electrically the light emitting diode chip and the electrode by using a bonding means; and sealing the light emitting diode chip and the bonding means by using a molding resin.

REFERENCES:
patent: 6730533 (2004-05-01), Durocher et al.
patent: 7332746 (2008-02-01), Takahashi et al.
patent: 7708427 (2010-05-01), Baroky et al.
patent: 7736020 (2010-06-01), Baroky et al.
patent: 6-350206 (1994-12-01), None
patent: 2000-77822 (2000-03-01), None
patent: 2007-220843 (2007-08-01), None
patent: 2007-311736 (2007-11-01), None
Korean Office Action issued Nov. 24, 2009 in corresponding Korean Patent Application 10-2008-0007332.
Japanese Office Action issued Jul. 19, 2011 in corresponding Japanese Patent Application 2008-260957.

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