Light-emitting diode package and manufacturing method thereof

Details Light-emitting diode package and manufacturing method thereof Light-emitting diode package and manufacturing method thereof

2007-02-28

2010-06-29

Andújar, Leonardo (Department: 2826)

Active solid-state devices (e.g., transistors, solid-state diode

Incoherent light emitter structure

With reflector, opaque mask, or optical element integral...

C257S099000, C257SE33056

Reexamination Certificate

active

07745844

ABSTRACT:
An LED package is provided. The LED package comprises a metal plate, circuit patterns, and an LED. The metal plate comprises grooves. The insulating layer is formed on the metal plate. The circuit patterns are formed on the insulating layer. The LED is electrically connected with the circuit pattern on the insulating layer.

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