Light emitting diode package

Active solid-state devices (e.g. – transistors – solid-state diode – Incoherent light emitter structure – With reflector – opaque mask – or optical element integral...

Reexamination Certificate

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Details

C257S099000, C257SE33072, C257SE33075

Reexamination Certificate

active

07999278

ABSTRACT:
Provided is an LED package. It is easy to control luminance according to the luminance and an angle applicable. Since heat is efficiently emitted, the LED package is easily applicable to a high luminance LED. The manufacturing process is convenient and the cost is reduced. The LED package includes a substrate, an electrode, an LED, and a heatsink hole. The electrode is formed on the substrate. The LED is mounted in a side of the substrate and is electrically connected to the electrode. The heatsink hole is formed to pass through the substrate, for emitting out heat generated from the LED.

REFERENCES:
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Notice of Allowance in U.S. Appl. No. 12/815,044 mailed Apr. 4, 2011.
Office Action in U.S. Appl. No. 12/683,929 mailed Mar. 31, 2011.

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