Light emitting diode package

Active solid-state devices (e.g. – transistors – solid-state diode – Incoherent light emitter structure – With reflector – opaque mask – or optical element integral...

Reexamination Certificate

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Details

C257S099000, C257S100000, C257SE33072, C257SE33075

Reexamination Certificate

active

07960750

ABSTRACT:
A light emitting diode package including a substrate; a plurality of electrodes on the substrate; a light emitting diode on the substrate; at least one wire connecting the light emitting diode and at least a first electrode of the plurality of electrodes; a reflecting member formed around the light emitting diode and being spaced apart from the light emitting diode; a cavity included in the reflecting member; a mold material including in the cavity; and a heat sink disposed under the light emitting diode and configured to emit heat generated by the light emitting diode. Further, a connection portion connecting the plurality of electrodes extends under a surface of the substrate through a portion of the substrate, and an inside surface of the reflecting member has a step-shape structure.

REFERENCES:
patent: 7218041 (2007-05-01), Isoda
patent: 7271423 (2007-09-01), Hanamoto et al.
patent: 7282853 (2007-10-01), Yano et al.
patent: 2004/0079957 (2004-04-01), Andrews et al.
patent: 2004/0129945 (2004-07-01), Uemura
patent: 2004/0188696 (2004-09-01), Hsing Chen et al.
patent: 2004/0208210 (2004-10-01), Inoguchi
patent: 2004/0222433 (2004-11-01), Mazzochette et al.
patent: 2005/0133698 (2005-06-01), Oniki et al.
patent: 2006/0092644 (2006-05-01), Mok et al.
patent: 2006/0124953 (2006-06-01), Negley et al.
patent: 2008/0043444 (2008-02-01), Hasegawa et al.
Office Action in U.S. Appl. No. 12/683,929 mailed Mar. 31, 2011.

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