Light emitting diode package

Details Light emitting diode package Light emitting diode package

2011-05-03

2011-05-03

Ngo, Ngan (Department: 2893)

Active solid-state devices (e.g., transistors, solid-state diode

Incoherent light emitter structure

With housing or contact structure

C257S098000, C257S100000, C257SE33059, C257SE33061

Reexamination Certificate

active

07935981

ABSTRACT:
A light emitting diode (LED) package includes a carrier, an LED chip, an encapsulant, a plurality of phosphor particles, and a plurality of anti-humidity particles. The LED chip is disposed on and electrically connected to the carrier. The encapsulant encapsulates the LED chip. The phosphor particles and the anti-humidity particles are distributed within the encapsulant. A first light emitted from the LED chip excites the phosphor particles to emit a second light. Some of the anti-humidity particles are adhered onto a surface of the phosphor particles, while the other anti-humidity particles are not adhered onto the surface of the phosphor particles. The anti-humidity particles absorb H2O so as to avoid H2O from being reacted with the phosphor particles. The LED package of the present application has favorable water resistance.

REFERENCES:
patent: 2007/0125984 (2007-06-01), Tian et al.
patent: 2008/0231162 (2008-09-01), Kurihara et al.
patent: 2008/0241590 (2008-10-01), Kim et al.
patent: 2010/0301738 (2010-12-01), Hosokawa et al.
patent: 200720404 (2007-06-01), None
patent: 200801159 (2008-01-01), None

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