Light emitting diode package

Details Light emitting diode package Light emitting diode package

2009-10-01

2011-12-27

Gurley, Lynne (Department: 2811)

Active solid-state devices (e.g., transistors, solid-state diode

Incoherent light emitter structure

With housing or contact structure

C257S100000, C257S706000, C257S720000, C257S722000, C257S783000, C257SE33056, C257SE33066, C257SE33076, C257SE23060, C257SE23066, C257SE23087, C257SE23110, C438S026000, C438S029000, C438S120000, C438S137000

Reexamination Certificate

active

08084778

ABSTRACT:
There is provided an LED package having high heat dissipation efficiency. An LED package according to an aspect of the invention may include: a package body including a first groove portion being recessed into the package body and provided as a mounting area on the top of the package body; first and second lead frames arranged on a lower surface of the first groove portion while parts of the first and second lead frames are exposed; an LED chip mounted onto the lower surface of the first groove portion and electrically connected to the first and second lead frames; and a plurality of heat dissipation patterns provided on the bottom of the package body and formed of carbon nanotubes.

REFERENCES:
patent: 2007/0018190 (2007-01-01), Kim et al.
patent: 2008/0224160 (2008-09-01), Chang et al.
patent: 2004-281996 (2004-10-01), None
patent: 10-2003-0062116 (2003-07-01), None

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