Light emitting diode package

Details Light emitting diode package Light emitting diode package

2006-07-26

2009-02-17

Pert, Evan (Department: 2826)

Active solid-state devices (e.g., transistors, solid-state diode

Incoherent light emitter structure

With reflector, opaque mask, or optical element integral...

C257SE33056

Reexamination Certificate

active

07491978

ABSTRACT:
A light emitting diode package is provided. The light emitting diode package comprises a submount substrate which includes a mounting region having side walls inclined upwardly, first and second cavities formed around the mounting region, and first and second grooves extending between the mounting region and the first and second cavities on an upper surface of the submount. The package further comprises first and second bump pads formed on a bottom surface of the mounting surface, first and second bonding pads formed on a bottom surface of the first and second cavities, respectively, first and second conductive lines formed along a bottom surface of the first and second grooves for connecting the first and second bump pads to the first and second bonding pads, respectively, and a light emitting diode mounted on the mounting region so as to be connected to the first and second bump pads.

REFERENCES:
patent: 6838689 (2005-01-01), Deng et al.
patent: 6881980 (2005-04-01), Ting
patent: 2005/0087866 (2005-04-01), Shei et al.

Affiliated with

Also associated with

Rating

Light emitting diode package does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Light emitting diode package, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Light emitting diode package will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-4094068