Light emitting diode package

Details Light emitting diode package Light emitting diode package

2006-12-07

2008-10-28

Ward, John A (Department: 2885)

Illumination

Light source and modifier

With ventilating, cooling or heat insulating means

C362S373000, C362S800000, C257S098000

Reexamination Certificate

active

07441926

ABSTRACT:
A light emitting diode package is disclosed. It includes a chip, a slug, a PCB, a lens and a reflector. The chip is mounted on the slug. The slug transmits the heat of the chip out of the light emitting diode package. The PCB connects the chip with circuits or wires. The lens transmits the emitting light of the chip out of the light emitting diode package. The reflector reflects the emitting light of the chip, and combines the slug, the PCB and the lens together.

REFERENCES:
patent: 6045240 (2000-04-01), Hochstein
patent: 6641284 (2003-11-01), Stopa et al.
patent: 7244965 (2007-07-01), Andrews et al.
patent: 2006/0180821 (2006-08-01), Fan et al.

Affiliated with

Also associated with

Rating

Light emitting diode package does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Light emitting diode package, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Light emitting diode package will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-4007673