Light emitting diode package

Details Light emitting diode package Light emitting diode package

2007-02-21

2008-09-16

Menz, Douglas M (Department: 2891)

Active solid-state devices (e.g., transistors, solid-state diode

Incoherent light emitter structure

With reflector, opaque mask, or optical element integral...

C257S788000

Reexamination Certificate

active

07425731

ABSTRACT:
A light emitting diode package with reduced light loss includes a package substrate, a light emitting diode chip mounted on the package substrate and an encapsulant formed on the package substrate to encapsulate the light emitting diode chip. The encapsulant has a refractive index gradient with refractive indices continuously increasing from a peripheral surface thereof to a central axis thereof.

REFERENCES:
patent: 6617400 (2003-09-01), Yeager et al.
patent: 6809162 (2004-10-01), Rubinsztajn
patent: 6841888 (2005-01-01), Yan et al.
patent: 7304425 (2007-12-01), Ouderkirk et al.
patent: 7314770 (2008-01-01), Boardman et al.

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