Light emitting diode package

Active solid-state devices (e.g. – transistors – solid-state diode – Incoherent light emitter structure – With reflector – opaque mask – or optical element integral...

Reexamination Certificate

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C257S099000, C257S100000, C257S013000, C257SE33067

Reexamination Certificate

active

07973328

ABSTRACT:
There is provided a light emitting diode (LED) package in which a phosphor layer encapsulating an LED chip is formed uniformly to facilitate a process. The LED package includes: a package body having a mounting area; a holding part mounted on the mounting area to expose a portion of the mounting area; an LED chip mounted on the mounting area, the LED chip surrounded by the holding part to emit light; and a phosphor layer held by the holding part to seal a space defined by the holding part, the phosphor layer converting a wavelength of the light from the LED chip.

REFERENCES:
patent: 6642652 (2003-11-01), Collins, III et al.
patent: 7391153 (2008-06-01), Suehiro et al.
patent: 2005/0151147 (2005-07-01), Izuno et al.
patent: 2008/0035942 (2008-02-01), Kim et al.
patent: 2008-042211 (2008-02-01), None
Korean Office Action, with English translation, issued in Korean Patent Application No. 10-2008-0046279, mailed Feb. 24, 2010.

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