Semiconductor device manufacturing: process – Making device or circuit emissive of nonelectrical signal
Reexamination Certificate
2008-05-09
2010-11-16
Tran, Thien F (Department: 2895)
Semiconductor device manufacturing: process
Making device or circuit emissive of nonelectrical signal
C438S024000
Reexamination Certificate
active
07833809
ABSTRACT:
A light emitting diode structure including a substrate, a strain-reducing seed layer, an epitaxial layer, a first electrode and a second electrode is provided. The strain-reducing seed layer having a plurality of clusters is disposed on the substrate, and the material of the clusters is selected from a group consisting of aluminum nitride, magnesium nitride and indium nitride. The epitaxial layer includes a first type doped semiconductor layer, a light emitting layer and a second type doped semiconductor layer. The first electrode is disposed on the exposed first type doped semiconductor layer and electrically connected thereto. The second electrode is disposed on the second type doped semiconductor layer and electrically connected thereto.
REFERENCES:
patent: 6455337 (2002-09-01), Sverdlov
patent: 6847046 (2005-01-01), Wei et al.
Kuo Cheng-Huang
Kuo Chi-Wen
Lai Wei-Chih
Jianq Chyun IP Office
National Central University
Tran Thien F
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