Electric lamp or space discharge component or device manufacturi – Process – Electrode making
Reexamination Certificate
2006-04-11
2006-04-11
Williams, Joseph (Department: 2879)
Electric lamp or space discharge component or device manufacturi
Process
Electrode making
C438S020000
Reexamination Certificate
active
07025651
ABSTRACT:
Disclosed is a LED which can be mounted at high density on a large area display. Having a hole for heat sink in the ceramic substrate, the LED is superior in heat sink property. In order to fabricate the light emitting device, first, a secondary ceramic sheet is stacked on the ceramic substrate, followed by forming electrodes in a predetermined pattern on the secondary ceramic sheet around the hole for heat sink. On the ceramic substrate, an upper ceramic sheet with an opening is stacked to form a stacked ceramic substrate in such a way that a part of the electrodes are exposed through the opening. After co-firing the stacked ceramic substrate, a light emitting diode chip is mounted on the secondary ceramic sheet at a position corresponding to the hole for heat sink. Then, the electrodes are electrically connected with the LED chip, and the LED chip is sealed with insulating resin. A light emitting device using the LED and a fabrication method therefor are also disclosed.
REFERENCES:
patent: 5998925 (1999-12-01), Shimizu et al.
patent: 6069440 (2000-05-01), Shimizu et al.
patent: 2000-315826 (2000-11-01), None
Lee Chang-Yong
Park Young-Ho
Song Kyung-Sub
Lowe Hauptman & Berner LLP
Samsung Electro-Mechanics Co. Ltd.
Williams Joseph
LandOfFree
Light emitting diode, light emitting device using the same,... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Light emitting diode, light emitting device using the same,..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Light emitting diode, light emitting device using the same,... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3525813