Semiconductor device manufacturing: process – Making device or circuit emissive of nonelectrical signal – Packaging or treatment of packaged semiconductor
Reexamination Certificate
2009-04-28
2010-11-23
Menz, Laura M (Department: 2813)
Semiconductor device manufacturing: process
Making device or circuit emissive of nonelectrical signal
Packaging or treatment of packaged semiconductor
C438S027000, C362S249010
Reexamination Certificate
active
07838312
ABSTRACT:
In a light-emitting diode light bar of a light-emitting device, a first lead and a second lead are juxtaposed with a distance. A light-emitting diode crystal has a first electrode and a second electrode. Then, the first electrode is electrically fixed to the first lead. The second electrode is electrically connected to the second lead via a metallic lead. A light-transmitting body is used to package the light-emitting diode crystal and the metallic lead. Finally, via a hot pressing process, an insulating layer covers the first lead and the second lead. In this way, a light-emitting diode light bar is formed.
REFERENCES:
patent: 4514791 (1985-04-01), Tokieda
patent: 4823106 (1989-04-01), Lovell
patent: 5550408 (1996-08-01), Kunitomo et al.
patent: 6880955 (2005-04-01), Lin
patent: 7173289 (2007-02-01), Wu et al.
patent: 7301174 (2007-11-01), Popovich
patent: 7303315 (2007-12-01), Ouderkirk et al.
patent: 7422345 (2008-09-01), Lin
patent: 7478925 (2009-01-01), Hiyama et al.
patent: 7507012 (2009-03-01), Aylward et al.
patent: 7556405 (2009-07-01), Kingsford et al.
patent: 2002/0149933 (2002-10-01), Archer et al.
patent: 2006/0279679 (2006-12-01), Fujisawa et al.
patent: 2007/0223226 (2007-09-01), Park
patent: 2007/0272933 (2007-11-01), Kim et al.
patent: 2009/0020770 (2009-01-01), Wang et al.
patent: 2009/0065789 (2009-03-01), Wang et al.
patent: 2009/0146156 (2009-06-01), Wang et al.
patent: 2009/0152570 (2009-06-01), Wang et al.
patent: 2009/0224266 (2009-09-01), Wang et al.
patent: 2009/0224653 (2009-09-01), Wang et al.
patent: 2010/0099207 (2010-04-01), Wang et al.
patent: 2010/0163916 (2010-07-01), Chiang
patent: 2010/0163917 (2010-07-01), Chiang
patent: 2010/0171132 (2010-07-01), Ahn et al.
patent: 558622 (2003-10-01), None
HDLS IPR Services
Jess-Link Products Co., Ltd.
Menz Laura M
Shih Chun-Ming
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