Light emitting diode (LED) packaging

Details Light emitting diode (LED) packaging Light emitting diode (LED) packaging

2006-08-08

2006-08-08

Parker, Kenneth (Department: 2815)

Active solid-state devices (e.g., transistors, solid-state diode

Incoherent light emitter structure

With housing or contact structure

C257S100000, C257S706000, C257S708000, C257S720000, C257S675000, C257S722000, C257SE33056, C257SE33058, C257SE33075

Reexamination Certificate

active

07087937

ABSTRACT:
A light emitting diode (LED) packaging comprising a stacked substrate, a main body, and an LED die is provided. The stacked substrate includes a heat spreader and a first circuit board. The first circuit board is stacked on the heat spreader. Two channels penetrate the first circuit board and the heat spreader. An upper opening of the channel is smaller than a lower opening thereof. The main body is formed on the first circuit board and has a through hole to expose part of the first circuit board. The main body further has at least two extended portion filling the channels for fixing the main body on the stacked substrate. The LED die is located in the through hole and electrically connected to the first circuit board.

REFERENCES:
patent: 2004/0156597 (2004-08-01), Kaneko
patent: 2004/0246877 (2004-12-01), Ishizaki et al.

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