Semiconductor device manufacturing: process – Bonding of plural semiconductor substrates
Reexamination Certificate
2006-03-07
2006-03-07
Hu, Shouxiang (Department: 2811)
Semiconductor device manufacturing: process
Bonding of plural semiconductor substrates
Reexamination Certificate
active
07008858
ABSTRACT:
A light emitting diode having an adhesive layer and a reflective layer and a manufacturing method thereof featured by adhering together a light emitting diode stack and a substrate having a reflective metal layer by use of a transparent adhesive layer so that the light rays directed to the reflective metal layer can be reflected therefrom to improve the brightness of the light emitting diode.
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Hsieh Min-Hsun
Liu Wen-Huang
Tseng Tzu-Feng
Wang Jen-Shui
Yeh Ting-Wei
Epistar Corporation
Hsu Winston
Hu Shouxiang
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