Light-emitting diode encapsulation material and...

Details Light-emitting diode encapsulation material and... Light-emitting diode encapsulation material and...

2005-10-25

2005-10-25

Tran, Minhloan (Department: 2826)

Semiconductor device manufacturing: process

Making device or circuit emissive of nonelectrical signal

C257S099000

Reexamination Certificate

active

06958250

ABSTRACT:
A light-emitting diode (LED) encapsulation material and manufacturing process comprising a photo-sensitive polymer constituting at least one of an Oligomer or a reactive Monomer, and a Photoinitiator. After a LED chip encapsulation, the photo-sensitive polymer is exposed to visible light or ultraviolet light, or electron beam, free of infrared rays, thereby triggering a free radical polymerization reaction of the photo-sensitive polymer, and rapid curing thereof under room temperature, eliminating the need for heating in a furnace during encapsulation manufacturing process of the light-emitting diode, while prompting rapid curing thereof, and thereby enhancing production efficiency.

REFERENCES:
patent: 4317862 (1982-03-01), Honda et al.
patent: 6018167 (2000-01-01), Oota
patent: 6114090 (2000-09-01), Wu et al.
patent: 2001/0026011 (2001-10-01), Roberts et al.

Affiliated with

Also associated with

Rating

Light-emitting diode encapsulation material and... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Light-emitting diode encapsulation material and..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Light-emitting diode encapsulation material and... will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3450915