Light-emitting diode device and method for fabricating the same

Active solid-state devices (e.g. – transistors – solid-state diode – Incoherent light emitter structure – With reflector – opaque mask – or optical element integral...

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C257S099000, C257SE33067, C438S027000, C438S029000, C438S033000, C438S042000

Reexamination Certificate

active

07928458

ABSTRACT:
A semiconductor device is disclosed. The semiconductor device comprises a light-emitting diode chip disposed in a cavity of a semiconductor substrate. At least two isolated outer wiring layers are disposed on the bottom surface of the semiconductor substrate and are electrically connected to the light-emitting diode chip, serving as input terminals. A lens module is adhered to the top surface of the semiconductor substrate to cap the cavity, in which the lens module comprises a molded lens and a molded fluorescent layer thereunder and the molded fluorescent layer faces the light-emitting diode chip. A method for fabricating the semiconductor devices is also disclosed.

REFERENCES:
patent: 5959316 (1999-09-01), Lowery
patent: 6576488 (2003-06-01), Collins, III et al.
patent: 2005/0212405 (2005-09-01), Negley
patent: 2005/0274959 (2005-12-01), Kim et al.
patent: 2008/0093617 (2008-04-01), Song et al.
patent: 2009/0026472 (2009-01-01), Yasuda et al.
patent: 2009/0045422 (2009-02-01), Kato et al.
patent: 2729906 (2005-09-01), None

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Light-emitting diode device and method for fabricating the same does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Light-emitting diode device and method for fabricating the same, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Light-emitting diode device and method for fabricating the same will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-2725023

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.