Light emitting diode covered with a reflective layer and...

Details Light emitting diode covered with a reflective layer and... Light emitting diode covered with a reflective layer and...

2007-09-18

2007-09-18

Pert, Evan (Department: 2826)

Semiconductor device manufacturing: process

Making device or circuit emissive of nonelectrical signal

Packaging or treatment of packaged semiconductor

C438S022000, C438S029000, C257SE33055

Reexamination Certificate

active

11234223

ABSTRACT:
A light emitting diode (LED) covered with a reflective layer by imprinting process is provided. The imprinting process includes coating a plastic layer on a mold to form an imprinting substrate; coating a reflective layer on the plastic layer and modifying the shape of the reflective layer to fit the shape of outer surfaces of the light emitting diode; softening the plastic layer and impressing the mold covered with the reflective layer upon the LED structure so that the reflective layer adheres to the surfaces of LED; and removing the mold. Because the reflective layer has high reflectivity, the light emitted from the top surface and side surfaces of LED is reflected back to the light extraction direction, and thereby the light extraction efficiency is enhanced.

REFERENCES:
patent: 2005/0104080 (2005-05-01), Ichihara et al.
patent: 2006/0033116 (2006-02-01), Chae et al.

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