Active solid-state devices (e.g. – transistors – solid-state diode – Incoherent light emitter structure – With reflector – opaque mask – or optical element integral...
Reexamination Certificate
2008-01-09
2010-11-23
Nguyen, Dao H (Department: 2818)
Active solid-state devices (e.g., transistors, solid-state diode
Incoherent light emitter structure
With reflector, opaque mask, or optical element integral...
C257S088000, C257S099000, C257SE21001, C257SE23056, C257SE33059, C257SE33075, C438S025000, C438S026000, C438S057000, C438S458000
Reexamination Certificate
active
07838895
ABSTRACT:
AN LED chip package body provides an LED chip with a pad-installed surface, a plurality of pads disposed on the pad-installed surface and a rear surface formed opposite the pad-installed surface. The LED chip package body further has a light-reflecting coating disposed on the pad-installed surface of the LED chip and a plurality of pad-exposed holes for exposure of the corresponding pads of the LED chip. The LED chip package body further comprises a light-transparent element disposed on the rear surface of the LED chip and a plurality of conductive projecting blocks. Each of the conductive projecting blocks is disposed on the corresponding pad of the LED chip.
REFERENCES:
patent: 6674159 (2004-01-01), Peterson et al.
patent: 7049635 (2006-05-01), Sano et al.
patent: 7339198 (2008-03-01), Shen
patent: 7427805 (2008-09-01), Shen
patent: 2001/0009342 (2001-07-01), Furukawa et al.
patent: 2003/0230751 (2003-12-01), Harada
Nguyen Dao H
Rosenberg , Klein & Lee
Suzhou Industrial Park Tony Lighting Technology Co., Ltd.
LandOfFree
Light-emitting diode chip package body and packaging method... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Light-emitting diode chip package body and packaging method..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Light-emitting diode chip package body and packaging method... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-4247395