Light-emitting diode chip package body and packaging method...

Details Light-emitting diode chip package body and packaging method... Light-emitting diode chip package body and packaging method...

2011-08-02

2011-08-02

Loke, Steven (Department: 2818)

Active solid-state devices (e.g., transistors, solid-state diode

Incoherent light emitter structure

C257S080000, C257S081000, C257S082000, C257S098000, C257S099000

Reexamination Certificate

active

07989817

ABSTRACT:
AN LED chip package body provides an LED chip with a pad-installed surface, a plurality of pads disposed on the pad-installed surface and a rear surface formed opposite the pad-installed surface. The LED chip package body further has a light-reflecting coating disposed on the pad-installed surface of the LED chip and a plurality of pad-exposed holes for exposure of the corresponding pads of the LED chip. The LED chip package body further comprises a light-transparent element disposed on the rear surface of the LED chip and a plurality of conductive projecting blocks. Each of the conductive projecting blocks is disposed on the corresponding pad of the LED chip.

REFERENCES:
patent: 2003/0057421 (2003-03-01), Chen
patent: 2003/0141506 (2003-07-01), Sano et al.

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