Semiconductor device manufacturing: process – Making device or circuit emissive of nonelectrical signal – Having diverse electrical device
Reexamination Certificate
2011-05-17
2011-05-17
Nguyen, Dao H (Department: 2818)
Semiconductor device manufacturing: process
Making device or circuit emissive of nonelectrical signal
Having diverse electrical device
C438S026000, C438S057000, C438S458000, C257S088000, C257S098000, C257S099000, C257S100000, C257SE21502, C257SE33061, C257SE33066, C257SE33072
Reexamination Certificate
active
07943403
ABSTRACT:
AN LED chip package body provides an LED chip with a pad-installed surface, a plurality of pads disposed on the pad-installed surface and a rear surface formed opposite the pad-installed surface. The LED chip package body further has a light-reflecting coating disposed on the pad-installed surface of the LED chip and a plurality of pad-exposed holes for exposure of the corresponding pads of the LED chip. The LED chip package body further comprises a light-transparent element disposed on the rear surface of the LED chip and a plurality of conductive projecting blocks. Each of the conductive projecting blocks is disposed on the corresponding pad of the LED chip.
REFERENCES:
patent: 6184544 (2001-02-01), Toda et al.
patent: 7049635 (2006-05-01), Sano et al.
patent: 2007/0075306 (2007-04-01), Hayashi et al.
Nguyen Dao H
Rosenberg , Klein & Lee
Suzhou Industrial Park Tony Lighting Technology Co., Ltd.
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