Light-emitting diode chip component and a light-emitting device

Details Light-emitting diode chip component and a light-emitting device Light-emitting diode chip component and a light-emitting device

1999-03-25

2000-07-25

Tran, Minh Loan

Active solid-state devices (e.g., transistors, solid-state diode

Incoherent light emitter structure

With housing or contact structure

257100, 257 88, H01L 3300

Patent

active

060939400

ABSTRACT:
An LED chip component has a resin molding which can be firmly fixed to an insulating substrate even in a case where the exposed area of the insulating substrate cannot be increased any further. To achieve this object, according to a first embodiment, a resin molding is so formed as to flow into (i.e., reach the inside of) a through hole formed in an insulating substrate, and according to a second embodiment, a resin molding is so formed as to flow into two cuts formed respectively at two opposing side edges of an insulating substrate so that the resin molding holds the insulating substrate at two opposing side edges.

REFERENCES:
patent: 5298768 (1994-03-01), Okazaki et al.
patent: 5475241 (1995-12-01), Harrah et al.
patent: 5814837 (1998-09-01), Okazaki
patent: 5841177 (1998-11-01), Komoto et al.

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