Light-emitting diode chip and method of manufacturing the same

Details Light-emitting diode chip and method of manufacturing the same Light-emitting diode chip and method of manufacturing the same

2009-12-30

2011-12-13

Lebentritt, Michael (Department: 2829)

Active solid-state devices (e.g., transistors, solid-state diode

Incoherent light emitter structure

C257SE21121, C438S042000

Reexamination Certificate

active

08076675

ABSTRACT:
An LED chip includes a substrate and a p-n junction type semiconductor light-emitting structure. The substrate has a first surface and a second surface opposite to the second surface. The p-n junction type semiconductor light-emitting structure is arranged on the first surface of the substrate. A plurality of blind holes is defined in the second surface of the substrate and extends from the second surface towards the first surface. A heat conductive material is filled in each of the plurality of blind holes thereby forming a plurality of heat conductive poles in the plurality of blind holes.

REFERENCES:
patent: 2002/0017653 (2002-02-01), Chuang
patent: 2005/0059238 (2005-03-01), Chen et al.
patent: 2007/0069222 (2007-03-01), Ko et al.

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