Light emitting diode array chip and method of fabricating same

Electric lamp and discharge devices – With luminescent solid or liquid material – Solid-state type

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357 17, 437 23, H01L 2120, H01L 3112

Patent

active

049336010

ABSTRACT:
An LED array chip comprising; a first semiconductor layer having p-type conduction; a second semiconductor layer having a n-type conduction, possessing forbidden band width smaller than the first layer and provided on the first layer, so as to form a semiconductor chip having a pn junction at the interface with the first layer; the second layer being divided into a first region and a second region by etching the second layer through to the pn junction, the first region thereof being divided to form individual plural LEDs of predetermined configuration, and the n-type layer in the second region being converted to the p-type layer as so to serve as a common region; individual electrodes respectively provided to the surfaces of the LEDs; and a common electrode provided to the common region, parts of the exposed surface of the p-type layer corresponding to the LEDs serving as light emitting surfaces. The LED array chip is mounted on a printed circuit board by directly bonding the individual electrodes and the common electrode to the corresponding electrode pads of the printed circuit.

REFERENCES:
patent: 3697336 (1972-10-01), Lamorte
patent: 4404730 (1983-09-01), Heimen
patent: 4801993 (1989-01-01), Ankri et al.

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