Light emitting diode apparatuses with heat pipes for thermal...

Details Light emitting diode apparatuses with heat pipes for thermal... Light emitting diode apparatuses with heat pipes for thermal...

2006-08-22

2006-08-22

Dickey, Thomas L. (Department: 2826)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With provision for cooling the housing or its contents

C257S714000

Reexamination Certificate

active

07095110

ABSTRACT:
A light emitting apparatus (10, 110, 210, 310, 410) includes one or more light emitting diode chips (12, 112, 212, 312, 412) disposed on a chip support wall (16, 116, 216) including printed circuitry (34, 134, 234, 360, 362, 460, 462) connecting with the light emitting diode chips. A heat pipe (24, 124, 224, 324, 424) has a sealed volume (22, 122, 222, 322, 422) defined by walls including the chip support wall and at least one additional wall (18, 20, 118, 120, 218). The heat pipe further includes a heat transfer fluid (26, 226, 326, 426) disposed in the sealed volume.

REFERENCES:
patent: 6252726 (2001-06-01), Verdiell
patent: 6330259 (2001-12-01), Dahm
patent: 6661544 (2003-12-01), Okino et al.
patent: 2005/0006754 (2005-01-01), Arik et al.
patent: 2005/0158687 (2005-07-01), Dahm
patent: 2 387 025 (2003-10-01), None
patent: WO 2003081127 (2003-10-01), None
patent: WO 2004/011848 (2004-02-01), None
U.S. Appl. No. 10/614,497, filed Jul. 2003, Weaver et al.

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