Light-emitting diode

Active solid-state devices (e.g. – transistors – solid-state diode – Incoherent light emitter structure – With particular dopant material

Reexamination Certificate

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Details

C257S091000, C257S098000, C257S099000, C257S088000

Reexamination Certificate

active

07053421

ABSTRACT:
A light-emitting diode (LED) mainly includes a surface mounted package. The surface mounted package includes a substrate, two composite metal layers positioned on the substrate and being insulated from each other, an LED chip electrically connected to the composite metal layers, and a sealing member covering the LED chip. Each of the composite metal layers has a silver layer for preventing solder paste from penetrating into space between the sealing member and the composite metal layers and for reflecting light beams generated by the LED chip.

REFERENCES:
patent: 6582643 (2003-06-01), Brunnhofer
patent: 2001-196641 (2001-07-01), None
patent: 2002-76161 (2002-03-01), None
patent: 474030 (2002-01-01), None
patent: 521409 (2003-02-01), None

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