Light emitting devices and method for fabricating the same

Details Light emitting devices and method for fabricating the same Light emitting devices and method for fabricating the same

2006-07-05

2008-10-14

Picardat, Kevin M (Department: 2822)

Semiconductor device manufacturing: process

Making device or circuit emissive of nonelectrical signal

Packaging or treatment of packaged semiconductor

C438S113000, C438S460000

Reexamination Certificate

active

07435606

ABSTRACT:
Light emitting devices and a method for fabricating the same have an advantage in that an etching film formed between a plurality of light emitting structures is removed to separate respective lateral surfaces of the light emitting structures from one another, and a substrate is removed to separate lower portions of the devices from each other, thereby further facilitating division of the devices. There are further advantages in that the devices are divided without carrying out a scribing process so that the occurrence of defects such as cracking or bending can be reduced, and spacing between the devices for the scribing process need not be maintained, thereby increasing the degree of integration of devices.

REFERENCES:
patent: 2004/0076016 (2004-04-01), Sato et al.
patent: 2004/0245535 (2004-12-01), D'Evelyn et al.

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